The risk scenario
Package mismatch is expensive on FPGA lines because the wrong ball count or temperature grade can make a good-looking offer unusable.
What can go wrong
- The label matches the base number but the suffix does not match the BOM
- A supplier quotes a fast delivery date but cannot provide packing evidence
- A substitute is offered before engineering has reviewed package and electrical fit
- Date-code restrictions are copied from old policy and block workable offers
Risk matrix for buyer review
| Signal | Risk level | Buyer action |
|---|---|---|
| Full label and package photos are available | Low | Continue supplier screening |
| Only stock text is provided | Medium | Request photos and date-code details |
| Supplier avoids traceability questions | High | Hold the offer and review another channel |
| Part suffix differs from BOM | High | Escalate to engineering before quote approval |
What to send before quotation
- Full orderable part number and manufacturer preference
- Target quantity and delivery destination
- Package, suffix, temperature grade and date-code requirement
- Approved alternates or parts that must not be substituted
- BOM file, photos or previous supplier documents when available
SDAK sourcing workflow
Step 1
Review the part number and package suffix
Step 2
Check realistic lead time and date-code expectations
Step 3
Screen supplier channel and documentation
Step 4
Return quote feedback with risk notes
Need sourcing support?
Send us your part number, target quantity, package requirement and delivery schedule. Our team will review the RFQ and respond with sourcing options.
